Thermal paste manufacturer and Thermal paste supplier in India.

The Importance of Heat Sink Compound in Heat Source Materials

Thermal paste has many names like heat sink paste, thermal gel, thermal interface material or other sink compound. It is a good conductivity of heat. It is widely used to maintain the best the heat generated in the computer machine. Just to show the thermal conductivity of a very high grade thermal paste is 8.5 W/mK, and the heat conductivity of a copper is 385 W/mk and for other metals like aluminum its 205 W/mk.

The thermal grease has a polymerizable liquid with large volume fractions of electrically insulting which is also thermal conductive filler. Typical all matrix materials are expoxies, silicones, urethanes and acrylates. The solvent based systems have hot melt adhesives which are sensitive tapes and are available more conveniently. Aliminium oxide, boron nitrate, zince oxide are the most used for fillers of these types of adhesives. The filler loading can maximum go high as 70-80% by mass and raises the thermal conductivity of the base matrix from 0.17-0.3 W(m.K)(Watts per meter- Kelvin)  up to 2 W(m-K).

Even looking at the silver thermal compounds of 3 to 8 W (m-K) or more, it consists of micronized sliver particles suspended in a silicone/ceramic medium. Moreover the metal based thermal grease can be electrically conduct and capacitive. If any of these flow into circuit, it can cause malfunctioning and damage of the function.

The most effective of these pastes consists of the entire liquid metal usually with the variation of the alloy galinstan which have a good thermal conductive that exceeds of 13 W (m-K).  It is also difficult to apply evenly and have the greatest risk that causes malfunction due to its spillage. These pastes highly contain a gallium like a corrosive to the material aluminum that cannot be used as aluminum heat sinks.

What is Delidding?

The process delidding aims to reduce CPU’s core temperature on the processors with a less than ideal thermal interface which is between the silicon head spreader. In PC’s and laptops these thermal paste is invariably used in between the top of the CPU and heat sink. In many CPU’s the is easily attached to the heat spreader by many solder, however in others the die is not directly attached to these heat spreader, it also maintains the contact via layer of the heat sink compound.

These are best for every CPU’s and other heat sources in the working computer or laptop machines.

Loading

Vote

Result 0 votes

Loading

HeatGO Technologies

0 votes